Содержание

I Введение

II Пайка полупроводников

III Пайка графита

Пайка графита со сталями

Пайка графита с медью

Пайка графита с графитом

IV Пайка стекла и металлов

I Introduction

In the given work features of the soldering of metals with nonmetallic materials, namely the soldering of semiconductors, the soldering of graphite with metals are considered, the soldering flew down with metals.

The soldering of semiconductors use as at internal installation of devices - the soldering current supply, the soldering of transition on crystal owner, and at external installation - the soldering of external conclusions, hermetic sealing.

Connection of graphite with metals is caused by economic reasons, and also necessity of realization of positive properties of graphite. Examples of such designs are lengthy heaters, crucibles and pumps for smelting of metals, electrodes of arc furnaces, large-sized anodes of mercury rectifiers, heaters of mine furnaces, high-temperature heat exchanger, heater elements, etc.

The soldering of metal with glass apply at creation of a different sort of vacuum devices (floodgates, observation ports, etc.), at manufacturing lamps (from tiny up to powerful generating), in manufacture of large mirrors of optical devices, for facing an internal part of pipes of oil pipelines, etc.

The fused glasses well moisten all metals under condition of presence on their surface of an adsorbing layer of oxide and heating to the corresponding temperature. Formation of strong connection between metal and glass depends on pressure in a zone of junction, presence of gas bubbles, process electrolysis and расстекловывания glasses.

II Soldering of semiconductors

A surface of a product from the semiconductor, subject to the soldering, preliminary cover by tin in melt solder with the help of a ultrasonic soldering iron, way of a galvanic covering (nickel plating, gilding).

The soldering make in furnaces with a controllable atmosphere (neutral, regenerative), in vacuum or a method of resistance preliminary covered by tin surfaces. At connection of products with available transition it is required to maintain strictly temperature of heating to what apply temperature regulators.

The soldering of thin electric conclusions can be carried out on air microsoldering irons with use of protective or active gumboil (alcohol a solution of rosin, a gumboil on the basis of chloride ammonium). After the gumboil soldering a product wash out deionized water and dry.

In manufacture of semiconductors of operation on assembly of a product under the soldering carry out in the assembly rulers having a controllable atmosphere and consisting of several survival suits connected among themselves in which air or nitrogen of the certain temperature and humidity moves.

At the soldering of semi-conductor materials solders should form electro-hole transition or not straightening ohmic contact. In manufacture germanium and silicon devices as a basis apply aluminium, indium and alloys on the basis of tin and lead. For creation in a place of contact of conductivity of electronic type in a basis of solders as impurity enter phosphorus, arsenic, antimony and bismuth. For maintenance of not straightening ohmic contact in a basis of solders add a bor and gallium.

At creation of transitions and ohmic contacts on intermetallic connections apply tin, bismuth, antimony, zinc, cadmium, etc.

Structures of solders and modes of the soldering germanium and silicon are resulted in tab. 1. To the soldering of semiconductors apply also solders - pastes on the basis of gallium. For maintenance of reliability of wetting of a contact surface use ultrasound.

Table 1

Compositions of the solders and modes of the soldering germanium and silicon

The structure of solders influences electric parameters soldering devices, therefore at a choice of solders it is necessary to take into account their physical properties, for example conduction, temperature factor of linear expansion.